首页
underplate
精华吧
→
答案
→
知识竞赛未分类
underplate
A、基底镀层
B、蚀刻不足
C、间断电源
正确答案:A
Tag:
英语单词知识竞赛
镀层
基底
时间:2024-07-12 20:51:22
上一篇:
packaging and interconnecting assembly
下一篇:
chip-on-glass(COG)
相关答案
1.
solvent resistance
2.
original production master
3.
magneto-fluid ink
4.
adsorption
5.
Photoimageable Dielectric
6.
pumice powder
7.
passivation
8.
degassing
9.
Activating
10.
Etchback
热门答案
1.
small outline l-leaded package(SOI)
2.
press platen
3.
small outline integrated circuit(SOIC)
4.
tape automated bonding(TAB)
5.
thick film thermistor
6.
stray current
7.
Quality control level
8.
mealing
9.
vesication
10.
thermal shock test